GPUs

AMD Radeon R7 8CU 758MHz GCN 3 vs Intel Graphics 4C 2500MHz Full Specs

512 Shaders
758MHz
512 Shaders
2.5GHz
Shared Memory29.9GB/sDDR3
Shared Memory136.5GB/s
·
··
776.2 GFLOPS
··
2.56 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon R7 8CU 758MHz GCN 3Radeon R7 8CU 758MHz GCN 3776.2 GFLOPSFP16
x1
Graphics 4C 2500MHzGraphics 4C 2500MHz81.92 TOPSINT4 Tensor
x105.54

Clock Speed
··
Clock Speed
··
Peak OPS
776.2 GFLOPSFP16
Peak OPS
81.92 TOPSINT4 Tensor
-
Tensor FP16-32
20.48 TFLOPS
-
Tensor BF16
20.48 TFLOPS
FP32
776.2 GFLOPS
FP32
2.56 TFLOPS
FP64
48.51 GFLOPS
FP64
640 GFLOPS
Tensor INT4
-
Tensor INT4
81.92 TOPS
-
Tensor INT8
40.96 TOPS
Pixel Rate
6.1 GPixel/s
Pixel Rate
40 GPixel/s
Texture Rate
24.3 GTexel/s
Texture Rate
80 GTexel/s

Shaders
512 Shaders
Shaders
512 Shaders
TMUs
32 TMUs
TMUs
32 TMUs
ROPs
8 ROPs
ROPs
16 ROPs
Tensor Cores
-
Tensor Cores
32 T-Cores
RT Cores
-
RT Cores
4 RT-Cores
CUs
8 CUs
EUs
32 EUs

Boost Clock
758MHz
Boost Clock
2.5GHz

L2 Cache
256KB shared
L2 Cache
4.1MB shared

Shared MemoryDDR3
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
1.9GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
29.9GB/s
Memory Bandwidth
136.5GB/s

Multi-Monitor
3
Multi-Monitor
3

Encoder Model
VCE 3.1
Encoder Model
Xe Media Engine

Decoder Model
UVD 6.0
Decoder Model
Xe Media Engine

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2016 branding
Branding
Graphics 2024 branding
Codename
Wani
Codename
Xe3 LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jun 1, 2016
Release Date
Jan 5, 2026

Foundry
GlobalFoundries
Foundry
Intel
Fabrication Node
28nm
Fabrication Node
Intel 3
Die Size
250mm²
Die Size
27mm²
Transistor Count
3.1 Billion
Transistor Count
-
Transistor Density
12 MTr/mm²
Transistor Density
-

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