GPUs

AMD Radeon R7 8CU 800MHz GCN 3 vs Intel Arc B370 2400MHz Full Specs

512 Shaders
800MHz
1,280 Shaders
2.4GHz
Shared Memory38.4GB/sDDR4
Shared Memory136.5GB/sLPDDR5X
··
819.2 GFLOPS
··
6.14 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Radeon R7 8CU 800MHz GCN 3Radeon R7 8CU 800MHz GCN 3819.2 GFLOPSFP16
x1
Arc B370 2400MHzArc B370 2400MHz196.6 TOPSINT4 Tensor
x240.00

Clock Speed
··
Clock Speed
··
Peak OPS
819.2 GFLOPSFP16
Peak OPS
196.6 TOPSINT4 Tensor
-
Tensor FP16-32
49.15 TFLOPS
-
Tensor BF16
49.15 TFLOPS
FP32
819.2 GFLOPS
FP32
6.14 TFLOPS
FP64
51.2 GFLOPS
FP64
1.54 TFLOPS
Tensor INT4
-
Tensor INT4
196.6 TOPS
-
Tensor INT8
98.3 TOPS
Pixel Rate
6.4 GPixel/s
Pixel Rate
96 GPixel/s
Texture Rate
25.6 GTexel/s
Texture Rate
192 GTexel/s

Shaders
512 Shaders
Shaders
1,280 Shaders
TMUs
32 TMUs
TMUs
80 TMUs
ROPs
8 ROPs
ROPs
40 ROPs
Tensor Cores
-
Tensor Cores
80 T-Cores
RT Cores
-
RT Cores
10 RT-Cores
CUs
8 CUs
EUs
80 EUs

Boost Clock
800MHz
Boost Clock
2.4GHz

L2 Cache
256KB shared
L2 Cache
16.4MB shared

Shared MemoryDDR4
Shared MemoryLPDDR5X
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
2.4GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
38.4GB/s
Memory Bandwidth
136.5GB/s
ECC
No
ECC
No

Multi-Monitor
3
Multi-Monitor
3

Encoder Model
VCE 3.1
Encoder Model
Xe Media Engine

Decoder Model
UVD 6.0
Decoder Model
Xe Media Engine

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2016 branding
Branding
Arc 2026 branding
Codename
Wani
Codename
Xe3 LPG
Chip Variant
-
Chip Variant
GT1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jun 1, 2017
Release Date
Jan 5, 2026

Foundry
GlobalFoundries
Foundry
Intel
Fabrication Node
28nm
Fabrication Node
Intel 3
Die Size
250mm²
Die Size
27mm²
Transistor Count
3.1 Billion
Transistor Count
-
Transistor Density
12 MTr/mm²
Transistor Density
-

No images available
No images available