Apple Radeon Pro 580 vs Intel Arc A570M Full Specs
2,304 Shaders 1.2GHz | 2,048 Shaders 1.3GHz |
8GB GDDR5217.6GB/s | 8GB GDDR6256GB/s |
·· 5.53 TFLOPS | ·· 5.33 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 125W | TDP 75W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 5.53 TFLOPSFP16 | Peak OPS 170.4 TOPSINT4 Tensor |
- | Tensor FP16-32 42.6 TFLOPS |
- | Tensor BF16 42.6 TFLOPS |
FP32 5.53 TFLOPS | FP32 5.33 TFLOPS |
FP64 345.6 GFLOPS | FP64 1.33 TFLOPS |
Tensor INT4 - | Tensor INT4 170.4 TOPS |
- | Tensor INT8 85.2 TOPS |
Pixel Rate 38.4 GPixel/s | Pixel Rate 83.2 GPixel/s |
Texture Rate 172.8 GTexel/s | Texture Rate 166.4 GTexel/s |
Shaders 2,304 Shaders | Shaders 2,048 Shaders |
TMUs 144 TMUs | TMUs 128 TMUs |
ROPs 32 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 256 T-Cores |
RT Cores - | RT Cores 16 RT-Cores |
CUs 36 CUs | EUs 256 EUs |
Base Clock 1.1GHz | Base Clock 300MHz |
Boost Clock 1.2GHz | Boost Clock 1.3GHz |
L1 16KB/CU | L1 - |
L2 Cache 2MB shared | L2 Cache 8MB shared |
8GB GDDR5 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 6.8GT/s | Memory Speed 16GT/s |
Memory Bandwidth 217.6GB/s | Memory Bandwidth 256GB/s |
ECC No | ECC No |
TDP 125W | TDP 75W |
Max Resolution 5120x2880 | Max Resolution 7680x4320 |
Refresh Rate Calculator 5120x2880 Resolution5K Refresh Rate 60Hz | Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz |
Multi-Monitor 3 | Multi-Monitor 4 |
Adaptive Sync FreeSync | Adaptive Sync FreeSync |
DSC Not Supported | DSC Not Supported |
HDCP HDCP 2.2 | HDCP - |
Shader Model 6.7 | Shader Model 6.6 |
DirectX DirectX 12Direct3D 12_0 | DirectX DirectX 12Direct3D 12_2 |
OpenGL 4.6OpenCL 2.1Vulkan 1.3 | OpenGL 4.6OpenCL 3Vulkan 1.3 |
GFX 8 | - |
Encoder VCE 3.0 | Encoder Arc |
Codec AVC (H.264) HEVC (H.265) - | Codec AVC (H.264) HEVC (H.265) AV1 |
Decoder UVD 6.3 | Decoder Arc |
Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 - AVC (H.264) HEVC (H.265) - | Codec - MPEG-2 - JPEG - VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
PCIe PCIe 3.0 x16 | PCIe PCIe 4.0 x16 |
Multi-GPU Multi-GPU Support SupportedMulti-GPU Type CrossFire XDMA | Multi-GPU - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Ellesmere | Codename Xe HPG |
Chip Variant Polaris 20 XL | Chip Variant DG2-256 |
Market Segment Laptop | Market Segment Laptop |
Release Date Jun 6, 2017 | Release Date Aug 1, 2023 |
Foundry GlobalFoundries | Foundry TSMC |
Fabrication Node 14LPP | Fabrication Node N6 |
Die Size 232mm² | Die Size 269mm² |
Transistor Count 5.7B | Transistor Count 11.5B |
Transistor Density 24.57 MTr/mm² | Transistor Density 42.75 MTr/mm² |
All-in-Ones | All-in-Ones - |





