ATI FireGL V7700 vs AMD Radeon PRO W7600 Full Specs
320 Shaders 775MHz | 2,048 Shaders 2.44GHz |
524MB GDDR472GB/s | 8GB GDDR6288GB/s |
·· 496 GFLOPS | ·· 19.99 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP - | TDP 130W |
Power Connectors - 1x 6-Pin | Power Connectors 1x 8-Pin - |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 496 GFLOPSFP32 | Peak OPS 79.95 TOPSINT4 Tensor |
- | Tensor FP16-16 19.99 TFLOPSTensor FP16-32 19.99 TFLOPS |
- | BF16 39.98 TFLOPSTensor BF16 19.99 TFLOPS |
FP32 496 GFLOPS | FP32 19.99 TFLOPS |
- | FP64 624.6 GFLOPS |
Tensor INT4 - | Tensor INT4 79.95 TOPS |
- | Tensor INT8 19.99 TOPS |
Pixel Rate 12.4 GPixel/s | Pixel Rate 156.2 GPixel/s |
Texture Rate 12.4 GTexel/s | Texture Rate 312.3 GTexel/s |
Shaders 320 Shaders | Shaders 2,048 Shaders |
TMUs 16 TMUs | TMUs 128 TMUs |
ROPs 16 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 64 T-Cores |
RT Cores - | RT Cores 32 RT-Cores |
CUs 4 CUs | CUs 32 CUs |
Base Clock - | Base Clock 1.72GHz |
Boost Clock 775MHz | Boost Clock 2.44GHz |
L2 Cache 256KB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.17TB/s |
524MB GDDR4 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 2.3GT/s | Memory Speed 18GT/s |
Memory Bandwidth 72GB/s | Memory Bandwidth 288GB/s |
ECC No | ECC No |
TDP - | TDP 130W |
Multi-Monitor 2 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
1x DisplayPort 1.0 | - |
1x DVI-I Dual-Link | - |
1x S-Video | - |
- | Encoder Model VCN 4.0 |
Decoder Model UVD 1.0 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1-Slots |
Height 111 mm (4.37")Width 254 mm (10")Depth 37 mm (1.46") | Height 115 mm (4.53")Width 241 mm (9.49")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors 1x 6-Pin | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Boom | Codename Hotpink Bonefish |
Chip Variant R670 GL | Chip Variant Navi 33 XL |
Market Segment Workstation | Market Segment Workstation |
Release Date Aug 6, 2007 | Release Date Aug 3, 2023 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 80nm | Fabrication Node N6 |
Die Size 420mm² | Die Size 204mm² |
Transistor Count 720 Million | Transistor Count 13.3 Billion |
Transistor Density 1.71 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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