ATI FirePro 3D V8700 vs AMD Radeon PRO W7400 Full Specs
800 Shaders 750MHz | 1,792 Shaders 1.1GHz |
1GB GDDR5108.8GB/s | 8GB GDDR6172.8GB/s |
·· 1.2 TFLOPS | ·· 7.88 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 151W | TDP 55W |
Power Connectors 2x 6-Pin | Power Connectors - |
FirePro 3D V87001.2 TFLOPSFP32
Radeon PRO W740031.54 TOPSINT4 TensorClock Speed ·· | Clock Speed ··· |
Peak OPS 1.2 TFLOPSFP32 | Peak OPS 31.54 TOPSINT4 Tensor |
- | Tensor FP16-16 7.88 TFLOPSTensor FP16-32 7.88 TFLOPS |
- | BF16 15.77 TFLOPSTensor BF16 7.88 TFLOPS |
FP32 1.2 TFLOPS | FP32 7.88 TFLOPS |
FP64 240 GFLOPS | FP64 246.4 GFLOPS |
Tensor INT4 - | Tensor INT4 31.54 TOPS |
- | Tensor INT8 7.88 TOPS |
Pixel Rate 12 GPixel/s | Pixel Rate 70.4 GPixel/s |
Texture Rate 30 GTexel/s | Texture Rate 123.2 GTexel/s |
Shaders 800 Shaders | Shaders 1,792 Shaders |
TMUs 40 TMUs | TMUs 112 TMUs |
ROPs 16 ROPs | ROPs 64 ROPs |
Tensor Cores - | Tensor Cores 56 T-Cores |
RT Cores - | RT Cores 28 RT-Cores |
CUs 10 CUs | CUs 28 CUs |
Base Clock - | Base Clock 1GHz |
Boost Clock 750MHz | Boost Clock 1.1GHz |
L2 Cache 256KB shared | L2 Cache 2MB shared |
L3 Cache - | L3 Cache 32MB shared |
L3 Bandwidth - | L3 Bandwidth 1.17TB/s |
1GB GDDR5 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 3.4GT/s | Memory Speed 10.8GT/s |
Memory Bandwidth 108.8GB/s | Memory Bandwidth 172.8GB/s |
TDP 151W | TDP 55W |
Multi-Monitor 2 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 4x DisplayPort 2.1 |
2x DisplayPort 1.0 | - |
1x DVI-I Dual-Link | - |
1x S-Video | - |
- | Encoder Model VCN 4.0 |
Decoder Model UVD 2.0 | Decoder Model VCN 4.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1-Slots |
Height 111 mm (4.37")Width 254 mm (10")Depth 37 mm (1.46") | Height 115 mm (4.53")Width 216 mm (8.5")Depth 20 mm (0.79") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors 2x 6-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Wekiva | Codename Hotpink Bonefish |
Chip Variant RV770 CE | Chip Variant Navi 33 XL |
Market Segment Workstation | Market Segment Workstation |
Release Date Sep 11, 2008 | Release Date Aug 7, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 55nm | Fabrication Node N6 |
Die Size 256mm² | Die Size 204mm² |
Transistor Count 956 Million | Transistor Count 13.3 Billion |
Transistor Density 3.73 MTr/mm² | Transistor Density 65.2 MTr/mm² |
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