GPUs

ATI FirePro 3D V8700 vs AMD Radeon PRO W7700 Full Specs

800 Shaders
750MHz
3,072 Shaders
2.6GHz
1GB GDDR5108.8GB/s
16GB GDDR6576GB/s
··
1.2 TFLOPS
··
31.95 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
151W
TDP
190W
Power Connectors
-
2x 6-Pin
Power Connectors
1x 8-Pin
-

FirePro 3D V8700FirePro 3D V87001.2 TFLOPSFP32
x1
Radeon PRO W7700Radeon PRO W7700127.8 TOPSINT4 Tensor
x106.50

Clock Speed
··
Clock Speed
···
Peak OPS
1.2 TFLOPSFP32
Peak OPS
127.8 TOPSINT4 Tensor
-
Tensor FP16-16
31.95 TFLOPS
Tensor FP16-32
31.95 TFLOPS
-
BF16
63.9 TFLOPS
Tensor BF16
31.95 TFLOPS
FP32
1.2 TFLOPS
FP32
31.95 TFLOPS
FP64
240 GFLOPS
FP64
998.4 GFLOPS
Tensor INT4
-
Tensor INT4
127.8 TOPS
-
Tensor INT8
31.95 TOPS
Pixel Rate
12 GPixel/s
Pixel Rate
249.6 GPixel/s
Texture Rate
30 GTexel/s
Texture Rate
499.2 GTexel/s

Shaders
800 Shaders
Shaders
3,072 Shaders
TMUs
40 TMUs
TMUs
192 TMUs
ROPs
16 ROPs
ROPs
96 ROPs
Tensor Cores
-
Tensor Cores
96 T-Cores
RT Cores
-
RT Cores
48 RT-Cores
CUs
10 CUs
CUs
48 CUs

Base Clock
-
Base Clock
1.9GHz
Boost Clock
750MHz
Boost Clock
2.6GHz

L2 Cache
256KB shared
L2 Cache
6.1MB shared
L3 Cache
-
L3 Cache
64MB shared
L3 Bandwidth
-
L3 Bandwidth
2.33TB/s

1GB GDDR5
16GB GDDR6
Memory Bus
256-bit
Memory Bus
256-bit
Memory Speed
3.4GT/s
Memory Speed
18GT/s
Memory Bandwidth
108.8GB/s
Memory Bandwidth
576GB/s

TDP
151W
TDP
190W

Multi-Monitor
2
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

-
4x DisplayPort 2.1
2x DisplayPort 1.0
-
1x DVI-I Dual-Link
-
1x S-Video
-

-
Encoder Model
VCN 4.0

Decoder Model
UVD 2.0
Decoder Model
VCN 4.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2-Slots
Height
111 mm (4.37")
Width
254 mm (10")
Depth
37 mm (1.46")
Height
111 mm (4.37")
Width
241 mm (9.49")
Depth
40 mm (1.57")
Cooling
Blower
1x Fan
Cooling
Blower
1x Fan
Power Connectors
2x 6-Pin
Power Connectors
1x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
FirePro branding
Branding
Radeon Pro 2023 branding
Codename
Wekiva
Codename
Wheat Nas
Chip Variant
RV770 CE
Chip Variant
Navi 32
Market Segment
Workstation
Market Segment
Workstation
Release Date
Sep 11, 2008
Release Date
Nov 13, 2023

Foundry
TSMC
Foundry
TSMC
Other Foundries
-
Other Foundries
TSMCMCD
Fabrication Node
55nm
-
Fabrication Node
N5
N6MCD
Die Size
256mm²
-
Die Size
200mm²
150mm²MCD
Transistor Count
956 Million
-
Transistor Count
28.1 Billion
8.2 BillionMCD
Transistor Density
3.73 MTr/mm²
-
Transistor Density
140.5 MTr/mm²
54.67 MTr/mm²MCD

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