Imagination PowerVR GX6450 A8 vs AMD Radeon R7 8CU 758MHz GCN 3 Full Specs

Summary

128 Shaders 475MHz	512 Shaders 758MHz
Shared Memory12.8GB/sLPDDR3	Shared Memory29.9GB/sDDR3
Peak·FP32·FP16 121.6 GFLOPS	Peak·FP32·FP16 776.2 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Theoretical Performance

Clock Speed475MHz UC·Boost·OC	Clock Speed758MHz UC·Boost·OC
Peak OPS 243.2 GFLOPSFP16	Peak OPS 776.2 GFLOPSFP16
FP32 121.6 GFLOPS	FP32 776.2 GFLOPS
FP64 7.6 GFLOPS	FP64 48.51 GFLOPS
Pixel Rate 3.8 GPixel/s	Pixel Rate 6.1 GPixel/s
Texture Rate 3.8 GTexel/s	Texture Rate 24.3 GTexel/s

Core Config

Shaders 128 Shaders	Shaders 512 Shaders
TMUs 8 TMUs	TMUs 32 TMUs
ROPs 8 ROPs	ROPs 8 ROPs
EUs 8 EUs	CUs 8 CUs

Clocks

Boost Clock 475MHz

Boost Clock 758MHz

Cache

L2 Cache -

L2 Cache 256KB shared

Memory

Shared MemoryLPDDR3	Shared MemoryDDR3
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 1.6GT/s	Memory Speed 1.9GT/s
Memory Bandwidth 12.8GB/s	Memory Bandwidth 29.9GB/s
ECC No	ECC No

Video Output

Multi-Monitor 1

Multi-Monitor 3

Encoder

-	Encoder Model VCE 3.1
Codec -	Codec AVC (H.264) HEVC (H.265)

Decoder

-	Decoder Model UVD 6.0
Codec -	Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 AVC (H.264) HEVC (H.265)

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Imagination	Manufacturer AMD
Chip Designer Imagination	Chip Designer AMD
Architecture Rogue	Architecture GCN 3
Family A Series	Family GCN 3
Branding	Branding
Codename Series6XT	Codename Wani
Chip Variant GXA6450	Chip Variant -
Market Segment Smartphone	Market Segment Laptop
Release Date Sep 19, 2014	Release Date Jun 1, 2016

Fabrication

Foundry TSMC	Foundry GlobalFoundries
Fabrication Node 20nm	Fabrication Node 28nm
Die Size 89mm²	Die Size 250mm²
Transistor Count 2 Billion	Transistor Count 3.1 Billion
Transistor Density 22 MTr/mm²	Transistor Density 12 MTr/mm²

Images