GPUs

Intel Graphics 3C 1900MHz vs AMD Radeon 840M 2900MHz Full Specs

384 Shaders
1.9GHz
256 Shaders
2.9GHz
Shared Memory102.4GB/sDDR5
Shared Memory128GB/s
·
··
1.46 TFLOPS
··
1.49 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Graphics 3C 1900MHzGraphics 3C 1900MHz2.92 TFLOPSFP16
x1
Radeon 840M 2900MHzRadeon 840M 2900MHz2.97 TFLOPSFP16
x1.02

Clock Speed
··
Clock Speed
···
Peak OPS
2.92 TFLOPSFP16
Peak OPS
2.97 TFLOPSFP16
-
BF16
2.97 TFLOPS
FP32
1.46 TFLOPS
FP32
1.49 TFLOPS
FP64
364.8 GFLOPS
FP64
92.8 GFLOPS
Pixel Rate
22.8 GPixel/s
Pixel Rate
92.8 GPixel/s
Texture Rate
45.6 GTexel/s
Texture Rate
46.4 GTexel/s

Shaders
384 Shaders
Shaders
256 Shaders
TMUs
24 TMUs
TMUs
16 TMUs
ROPs
12 ROPs
ROPs
32 ROPs
RT Cores
3 RT-Cores
RT Cores
4 RT-Cores
EUs
48 EUs
CUs
4 CUs

Base Clock
-
Base Clock
1.5GHz
Boost Clock
1.9GHz
Boost Clock
2.9GHz

L2 Cache
3.1MB shared
L2 Cache
-

Shared MemoryDDR5
Shared Memory
·
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
6.4GT/s
Memory Speed
8GT/s
Memory Bandwidth
102.4GB/s
Memory Bandwidth
128GB/s

Multi-Monitor
4
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.3

Encoder Model
Arc
Encoder Model
VCN 4.0

Decoder Model
Arc
Decoder Model
VCN 4.0

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Graphics 2024 branding
Branding
Radeon 2023 branding
Codename
Xe LPG
Codename
Strix Point
Chip Variant
GT1
Chip Variant
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Dec 14, 2023
Release Date
Jan 6, 2025

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N5
Fabrication Node
N4P
Die Size
23mm²
Die Size
233mm²
Transistor Count
-
Transistor Count
28 Billion
Transistor Density
-
Transistor Density
120 MTr/mm²

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