GPUs

Intel Graphics 4C 2000MHz vs AMD Radeon R7 8CU 1108MHz GCN 3 Full Specs

512 Shaders
2GHz
512 Shaders
1.11GHz
Shared Memory134.4GB/s
·
Shared Memory38.4GB/sDDR4
··
2.05 TFLOPS
··
1.14 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

Graphics 4C 2000MHzGraphics 4C 2000MHz4.1 TFLOPSFP16
x3.61
Radeon R7 8CU 1108MHz GCN 3Radeon R7 8CU 1108MHz GCN 31.14 TFLOPSFP16
x1

Clock Speed
··
Clock Speed
··
Peak OPS
4.1 TFLOPSFP16
Peak OPS
1.14 TFLOPSFP16
FP32
2.05 TFLOPS
FP32
1.14 TFLOPS
FP64
512 GFLOPS
FP64
70.91 GFLOPS
Pixel Rate
32 GPixel/s
Pixel Rate
8.9 GPixel/s
Texture Rate
64 GTexel/s
Texture Rate
35.5 GTexel/s

Shaders
512 Shaders
Shaders
512 Shaders
TMUs
32 TMUs
TMUs
32 TMUs
ROPs
16 ROPs
ROPs
8 ROPs
RT Cores
4 RT-Cores
RT Cores
-
EUs
64 EUs
CUs
8 CUs

Boost Clock
2GHz
Boost Clock
1.11GHz

L2 Cache
4.1MB shared
L2 Cache
256KB shared

Shared Memory
·
Shared MemoryDDR4
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
8.4GT/s
Memory Speed
2.4GT/s
Memory Bandwidth
134.4GB/s
Memory Bandwidth
38.4GB/s
ECC
No
ECC
No

Multi-Monitor
4
Multi-Monitor
3

Encoder Model
Arc
Encoder Model
VCE 3.1

Decoder Model
Arc
Decoder Model
UVD 6.0

Form Factor
iGPU
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Graphics 2024 branding
Branding
Radeon 2016 branding
Codename
Xe LPG
Codename
Wani
Chip Variant
GT1
Chip Variant
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Dec 14, 2023
Release Date
Oct 1, 2016

Foundry
TSMC
Foundry
GlobalFoundries
Fabrication Node
N5
Fabrication Node
28nm
Die Size
23mm²
Die Size
250mm²
Transistor Count
-
Transistor Count
3.1 Billion
Transistor Density
-
Transistor Density
12 MTr/mm²

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