GPUs

NVIDIA GeForce MX250 25W vs AMD Radeon 860M 3000MHz Full Specs

384 Shaders
1.58GHz
384 Shaders
3GHz
2GB GDDR556GB/s
Shared Memory128GB/s
·
··
1.22 TFLOPS
··
2.3 TFLOPS
Form Factor
Soldered
Form Factor
iGPU
TDP
25W
TDP
Shared

GeForce MX250 25WGeForce MX250 25W1.22 TFLOPSFP32
x1
Radeon 860M 3000MHzRadeon 860M 3000MHz4.61 TFLOPSFP16
x3.79

Clock Speed
···
Clock Speed
···
Peak OPS
1.22 TFLOPSFP32
Peak OPS
4.61 TFLOPSFP16
-
BF16
4.61 TFLOPS
FP32
1.22 TFLOPS
FP32
2.3 TFLOPS
FP64
37.97 GFLOPS
FP64
144 GFLOPS
Pixel Rate
25.3 GPixel/s
Pixel Rate
96 GPixel/s
Texture Rate
38 GTexel/s
Texture Rate
72 GTexel/s

Shaders
384 Shaders
Shaders
384 Shaders
TMUs
24 TMUs
TMUs
24 TMUs
ROPs
16 ROPs
ROPs
32 ROPs
RT Cores
-
RT Cores
6 RT-Cores
SMs
3 SMs
CUs
6 CUs

Base Clock
1.52GHz
Base Clock
1.5GHz
Boost Clock
1.58GHz
Boost Clock
3GHz

L2 Cache
512KB shared
L2 Cache
-

2GB GDDR5
Shared Memory
·
Memory Bus
64-bit
Memory Bus
128-bit
Memory Speed
7GT/s
Memory Speed
8GT/s
Memory Bandwidth
56GB/s
Memory Bandwidth
128GB/s

TDP
25W
TDP
Shared

Multi-Monitor
2
Multi-Monitor
4
HDCP
HDCP 2.2
HDCP
HDCP 2.3

-
Encoder Model
VCN 4.0

Decoder Model
NVDEC 3
Decoder Model
VCN 4.0

Form Factor
Soldered
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
GeForce MX branding
Branding
Radeon 2023 branding
Codename
NV138
Codename
Strix Point
Chip Variant
GP108-200-A1
Chip Variant
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Feb 20, 2019
Release Date
Jan 6, 2025

Foundry
Samsung
Foundry
TSMC
Fabrication Node
14LPP
Fabrication Node
N4P
Die Size
74mm²
Die Size
233mm²
Transistor Count
1.8 Billion
Transistor Count
28 Billion
Transistor Density
24.32 MTr/mm²
Transistor Density
120 MTr/mm²

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