AMD FirePro W8100 vs AMD FirePro W9000 Full Specs
2,560 Shaders 824MHz | 2,048 Shaders 975MHz |
8GB GDDR5320GB/s | 6GB GDDR5264GB/s |
·· 4.22 TFLOPS | ·· 3.99 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 220W | TDP 275W |
Power Connectors - 2x 6-Pin | Power Connectors 1x 8-Pin 1x 6-Pin |
FirePro W81004.22 TFLOPSFP32
FirePro W90003.99 TFLOPSFP32Clock Speed ·· | Clock Speed ·· |
Peak OPS 4.22 TFLOPSFP32 | Peak OPS 3.99 TFLOPSFP32 |
FP32 4.22 TFLOPS | FP32 3.99 TFLOPS |
FP64 527.4 GFLOPS | FP64 998.4 GFLOPS |
Pixel Rate 52.7 GPixel/s | Pixel Rate 31.2 GPixel/s |
Texture Rate 131.8 GTexel/s | Texture Rate 124.8 GTexel/s |
Shaders 2,560 Shaders | Shaders 2,048 Shaders |
TMUs 160 TMUs | TMUs 128 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
CUs 40 CUs | CUs 32 CUs |
Boost Clock 824MHz | Boost Clock 975MHz |
L2 Cache 1MB shared | L2 Cache 768KB shared |
8GB GDDR5 | 6GB GDDR5 |
Memory Bus 512-bit | Memory Bus 384-bit |
Memory Speed 5GT/s | Memory Speed 5.5GT/s |
Memory Bandwidth 320GB/s | Memory Bandwidth 264GB/s |
ECC - | ECC Yes |
TDP 220W | TDP 275W |
Multi-Monitor 3 | Multi-Monitor 6 |
HDCP HDCP 1.4 | HDCP - |
4x DisplayPort 1.2 | - |
- | 6x Mini DisplayPort 1.2 |
1x SDI | 1x SDI |
Encoder Model VCE 2.0 | Encoder Model VCE 1.0 |
Decoder Model UVD 4.2 | Decoder Model UVD 3.2 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 111 mm (4.37")Width 279 mm (10.98")Depth 37 mm (1.46") | Height 111 mm (4.37")Width 279 mm (10.98")Depth 37 mm (1.46") |
Cooling Blower 1x Fan | Cooling Blower 1x Fan |
Power Connectors 2x 6-Pin | Power Connectors 1x 8-Pin, 1x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Hawaii | Codename Tahiti |
Chip Variant Hawaii Pro | Chip Variant Tahiti LE |
Market Segment Workstation | Market Segment Workstation |
Release Date Jun 26, 2014 | Release Date Jun 14, 2012 |
Foundry TSMC | Foundry TSMC |
Fabrication Node 28nm | Fabrication Node 28nm |
Die Size 438mm² | Die Size 352mm² |
Transistor Count 6.2 Billion | Transistor Count 4.3 Billion |
Transistor Density 14.16 MTr/mm² | Transistor Density 12.25 MTr/mm² |
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