GPUs

AMD Radeon 860M 3000MHz vs ATI Radeon HD 4670 Mac Full Specs

384 Shaders
3GHz
320 Shaders
680MHz
Shared Memory128GB/s
·
524MB GDDR325.3GB/s
··
2.3 TFLOPS
··
435.2 GFLOPS
Form Factor
iGPU
Form Factor
MXM-A
TDP
Shared
TDP
35W

Radeon 860M 3000MHzRadeon 860M 3000MHz4.61 TFLOPSFP16
x10.59
Radeon HD 4670 MacRadeon HD 4670 Mac435.2 GFLOPSFP32
x1

Clock Speed
···
Clock Speed
··
Peak OPS
4.61 TFLOPSFP16
Peak OPS
435.2 GFLOPSFP32
BF16
4.61 TFLOPS
-
FP32
2.3 TFLOPS
FP32
435.2 GFLOPS
FP64
144 GFLOPS
-
Pixel Rate
96 GPixel/s
Pixel Rate
5.4 GPixel/s
Texture Rate
72 GTexel/s
Texture Rate
21.8 GTexel/s

Shaders
384 Shaders
Shaders
320 Shaders
TMUs
24 TMUs
TMUs
32 TMUs
ROPs
32 ROPs
ROPs
8 ROPs
RT Cores
6 RT-Cores
RT Cores
-
CUs
6 CUs
CUs
4 CUs

Base Clock
1.5GHz
Base Clock
-
Boost Clock
3GHz
Boost Clock
680MHz

L2 Cache
-
L2 Cache
256KB shared

Shared Memory
·
524MB GDDR3
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
8GT/s
Memory Speed
1.6GT/s
Memory Bandwidth
128GB/s
Memory Bandwidth
25.3GB/s
ECC
No
ECC
No

TDP
Shared
TDP
35W

Multi-Monitor
4
Multi-Monitor
2
HDCP
HDCP 2.3
HDCP
-

Encoder Model
VCN 4.0
-

Decoder Model
VCN 4.0
Decoder Model
UVD 2.0

Form Factor
iGPU
Form Factor
MXM-A

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2023 branding
Branding
Radeon 2008 branding
Codename
Strix Point
Codename
Mario
Chip Variant
-
Chip Variant
RV730 Pro
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Jan 9, 2009

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N4P
Fabrication Node
55nm
Die Size
233mm²
Die Size
146mm²
Transistor Count
28 Billion
Transistor Count
514 Million
Transistor Density
120 MTr/mm²
Transistor Density
3.52 MTr/mm²

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