GPUs

ATI Mobility Radeon HD 3870 X2 vs AMD Radeon 860M 3000MHz Full Specs

640 Shaders
660MHz
384 Shaders
3GHz
1048MB GDDR3
Shared Memory128GB/s
·
··
844.8 GFLOPS
··
2.3 TFLOPS
Form Factor
MXM-II
Form Factor
iGPU
TDP
110W
TDP
Shared

Mobility Radeon HD 3870 X2Mobility Radeon HD 3870 X2844.8 GFLOPSFP32 (2x 422.4 GFLOPS)
x1
Radeon 860M 3000MHzRadeon 860M 3000MHz4.61 TFLOPSFP16
x5.45

Clock Speed
··
Clock Speed
···
Peak OPS
844.8 GFLOPSFP32
Peak OPS
4.61 TFLOPSFP16
-
BF16
4.61 TFLOPS
FP32
844.8 GFLOPS
FP32
2.3 TFLOPS
FP64
169 GFLOPS
FP64
144 GFLOPS
Pixel Rate
10.6 GPixel/s
Pixel Rate
96 GPixel/s
Texture Rate
10.6 GTexel/s
Texture Rate
72 GTexel/s

Shaders
640 Shaders
Shaders
384 Shaders
TMUs
32 TMUs
TMUs
24 TMUs
ROPs
32 ROPs
ROPs
32 ROPs
RT Cores
-
RT Cores
6 RT-Cores
Units
-
CUs
6 CUs

Base Clock
-
Base Clock
1.5GHz
Boost Clock
660MHz
Boost Clock
3GHz

L2 Cache
256KB shared
L2 Cache
-

1048MB GDDR3
Shared Memory
·
Memory Bus
-
Memory Bus
128-bit
Memory Speed
1.7GT/s
Memory Speed
8GT/s
Memory Bandwidth
-
Memory Bandwidth
128GB/s

TDP
110W
TDP
Shared

Multi-Monitor
2
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.3

-
Encoder Model
VCN 4.0

Decoder Model
UVD 1.0
Decoder Model
VCN 4.0

Form Factor
MXM-II
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Radeon 2007 branding
Branding
Radeon 2023 branding
Codename
Boom
Codename
Strix Point
Chip Variant
R680 XT
Chip Variant
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Sep 1, 2008
Release Date
Jan 6, 2025

Foundry
TSMC
Foundry
TSMC
Fabrication Node
55nm
Fabrication Node
N4P
Die Size
192mm²
Die Size
233mm²
Transistor Count
666 Million
Transistor Count
28 Billion
Transistor Density
3.47 MTr/mm²
Transistor Density
120 MTr/mm²

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