Imagination PowerVR GX6450 A8 vs AMD Radeon R6 6CU 720MHz GCN 3 Full Specs

Summary

128 Shaders 475MHz	384 Shaders 720MHz
Shared Memory12.8GB/sLPDDR3	Shared Memory34.1GB/s DDR3·DDR4
Peak·FP32·FP16 121.6 GFLOPS	Peak·FP32·FP16 553 GFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth

PowerVR GX6450 A8243.2 GFLOPSFP16

x1

Radeon R6 6CU 720MHz GCN 3553 GFLOPSFP16

x2.27

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Theoretical Performance

Clock Speed475MHz UC·Boost·OC	Clock Speed720MHz UC·Boost·OC
Peak OPS 243.2 GFLOPSFP16	Peak OPS 553 GFLOPSFP16
FP32 121.6 GFLOPS	FP32 553 GFLOPS
FP64 7.6 GFLOPS	FP64 34.56 GFLOPS
Pixel Rate 3.8 GPixel/s	Pixel Rate 5.8 GPixel/s
Texture Rate 3.8 GTexel/s	Texture Rate 17.3 GTexel/s

Core Config

Shaders 128 Shaders	Shaders 384 Shaders
TMUs 8 TMUs	TMUs 24 TMUs
ROPs 8 ROPs	ROPs 8 ROPs
EUs 8 EUs	CUs 6 CUs

Clocks

Boost Clock 475MHz

Boost Clock 720MHz

Cache

L1 -	L1 16KB/CU
L2 Cache -	L2 Cache 256KB shared

Memory

Shared MemoryLPDDR3	Shared Memory DDR3·DDR4
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 1.6GT/s	Memory Speed 2.1GT/s
Memory Bandwidth 12.8GB/s	Memory Bandwidth 34.1GB/s
ECC No	ECC No

Video Output

Max Resolution 2048x1536	Max Resolution 4096x2160
Refresh Rate Calculator 1920x1080 Resolution1080p FHD Refresh Rate 91Hz	Refresh Rate Calculator 3840x2160 Resolution4K UHD Refresh Rate 64Hz
Multi-Monitor 1	Multi-Monitor 3
DSC Not Supported	DSC Not Supported

API Support

Shader Model -	Shader Model 6.5
DirectX DirectX 10 Direct3D 10_0	DirectX DirectX 12 Direct3D 12_0
OpenGL 3.3 OpenCL 1.2 Vulkan 1.1	OpenGL 4.6 OpenCL 2.1 Vulkan 1.2
-	GFX 8

Encoder

-	Encoder VCE 3.1
Codec -	Codec AVC (H.264) HEVC (H.265)

Decoder

-	Decoder UVD 6.0
Codec -	Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 AVC (H.264) HEVC (H.265)

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Imagination	Manufacturer AMD
Chip Designer Imagination	Chip Designer AMD
Architecture Rogue	Architecture GCN 3
Family A Series	Family GCN 3
Branding	Branding
Codename Series6XT	Codename Wani
Chip Variant GXA6450	Chip Variant -
Market Segment Smartphone	Market Segment Laptop
Release Date Sep 19, 2014	Release Date Jun 1, 2015

Fabrication

Foundry TSMC	Foundry GlobalFoundries
Fabrication Node 20nm	Fabrication Node 28nm
Die Size 89mm²	Die Size 250mm²
Transistor Count 2B	Transistor Count 3.1B
Transistor Density 22 MTr/mm²	Transistor Density 12 MTr/mm²

Images

Used In

CPUs AppleA82 CoresAppleA8 (iPad)2 Cores	CPUs AMDA8-8600P2 CoresAMDPRO A8-8600B2 CoresAMDRX-416GD2 Cores
Smartphones AppleiPhone 6AppleiPhone 6 Plus	Smartphones -
Tablets AppleiPad mini 4A8, Late 2015	Tablets -

Competitors

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AMDRadeon R6 6CU 720MHz GCN 3 vs GPU AMDRadeon R6 6CU 800MHz GCN 3 AMDRadeon R6 6CU 720MHz GCN 3 vs GPU AMDRadeon R7E 6CU 626MHz GCN 3 AMDRadeon R6 6CU 720MHz GCN 3 vs GPU AMDRadeon R5 6CU 758MHz GCN 3 Show 12 more